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Product Details for TCM - BF537
The TCM-BF537 is an ultra small Core Module designed for industrial temperature range and volume production. It combines Power Supply, RAM and FLASH into a module as small as a chip package. Two 60 pin expansion connectors allow quick prototyping. The module is also available with Border Pads (BP) or a Ball Grid Array (BGA) for low height integrations into the final product.
Features
CPU Analog Devices (R) ADSP-BF537 Blackfin Processor
CLOCK 500 MHz
CRYSTAL 25 MHz
RAM 32MB SDRAM
FLASH 8 MB
PPI 16Bit 1
SPI 1
UART 2
SPP 1
I2C 1
CAN 1
ETHERNET 10/100 MBit, external Physical Chip required
TEMP. RANGE Extended temperature range : -40 to +85 °C
DIMENSIONS 28x28mm, 4 grams
ADITIONAL FEATURES

Single 3.3V Supply voltage
On-Board core voltage regulator
Low voltage reset circuit
2x 60 pin 0.6mm pitch connector

Border Pads (BP) or Ball Grid Array (BGA) versions available
RoHS RoHS compliant
BOOTLOADER BLACKSheep bootloader



Typical Applications
Industrial Automation & Control
Industrial Handheld Applications
Medium to High Volume Applications
 
Development Support
EVAL-BF5xx Evaluation Board
DEV-BF5xxDA-Lite Development Board
BLACKSheep® OS Software
uClinux Port available at blackfin.uclinux.org
Order No. Info Status
100-1225 TCM-BF537 Core processor module 500MHz with Connectors Available    prices    ordering
100-1226 TCM-BF537 Core processor module 500MHz with Border Pads (BP) Available    prices    ordering
100-1227 TCM-BF537 Core processor module 500MHz with Ball Grid Array (BGA) Samples available (for higher volumes only)


For the Product Revision History please see the Revision Report

For general support visit our support site

For prices please see our price list

 
                                                        
Order Information

 Distributor  Order No. Link
 Bluetechnix                
100-1225, 100-1226, 100-1227
  
 Local Distributors    click here
 Farnell 1495606, 1700956  click here
 Digi-Key    click here
 Silica TCM-BF537BP: XYZTCMBF537BPBOR!A

 click here

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